酒农饭抛农内府酒(Accretech Korea)

 

 


 
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Wafer Slicing Machine: S-LM-116G

Precise slicing machine for fragile materials such as glass, ceramics, ferrite.


Feature 1 :
16"-size blade for easy handling, lifting and adjustment.

Feature 2 :
Open-structure loading unit for easy mounting of the workpiece.

Feature 3 :
Easy setting of slicing speed and wafer thickness with digital switch.

Feature 4 :
Strong frame, highly rigid table provides long-term stability in performance.

Feature 5 :
Easy coolant adjustment and dressing operation.