酒农饭抛农内府酒(Accretech Korea)

 

 


 
Home > Product > Wafer Manufacturing System > W-GM-4200     



Wafer Edge Grinding: W-GM-4200

  • Newly-developed grinding unit enhances the rotative precision of the spindle, and improves the surface roughness.
  • The non-contact measuring method achieves the stable alignment.
  • Performs the non-contact measuring of the pre-processed wafer thickness at multiple points, the diameter and notch depth of the post-processed wafer.
  • The modular concept to make the optimum process line possible.
  • Low damage grinding method is available.


Feature 1 :
Machine specification ready for 75 - 150 mm wafer or for 150 - 200 mm wafer.

Feature 2 :
Capable of various material processes, such as chemical compound semiconductor.