酒农饭抛农内府酒(Accretech Korea)

 

 


 
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Wafer Edge Grinding: W-GM-5200

  • Newly-developed grinding unit enhances the rotative precision of the spindle, and improves the surface roughness.
  • The non-contact measuring method achieves the stable alignment.
  • Performs the non-contact measuring of the pre-processed wafer thickness at multiple points, the diameter and notch depth of the post-processed wafer.
  • The modular concept to make the optimum process line possible.
  • Low damage grinding method is available.

Feature 1 :
Machine specification ready for 300 mm and 200 mm wafer.

Feature 2 :
Visual system (optional) for measuring the chamfer width of periphery and notch.