Wafer Edge Grinding: W-GM-5200
- Newly-developed grinding unit enhances the rotative precision of the spindle, and improves the surface roughness.
- The non-contact measuring method achieves the stable alignment.
- Performs the non-contact measuring of the pre-processed wafer thickness at multiple points, the diameter and notch depth of the post-processed wafer.
- The modular concept to make the optimum process line possible.
- Low damage grinding method is available.