酒农饭抛农内府酒(Accretech Korea)

 

 


 
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Wafer Probing Machine: UF190R

Evolving and Proliferating Wafer Probing Machine, UF Series Based on a flexible platform, the high accuracy and high rigidity, UF series is further evolved. Wafers are varying with the progress of line width shrinkage and assembly technology. This machine can be used for processing very thin wafers and can be used as a handler for the wafer level burn-in system.



Feature 1 :

High-performance, high-throughput, and excellent cost performance machine.

Feature 2 :

The UF190A features the same high-performance and excellent operability as the UF200 earned a reputation including the automatic needle alignment function and the color LCD touch panel.