Wafer Probing Machine: UF200R
Evolving and Proliferating Wafer Probing Machine, UF Series
Based on a flexible platform, the high accuracy and high rigidity, UF series is further evolved. Wafers are varying with the progress of line width shrinkage and assembly technology. This machine can be used for processing very thin wafers and can be used as a handler for the wafer level burn-in system.
Feature 1 :
8-inch multipurpose machine.