酒农饭抛农内府酒(Accretech Korea)

 

 


 
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Wafer Probing Machines: UF3000EX-e

Assimilating the up-to-date technologies such as originative OTS, QPU and TTG, this super high-spec system provides the testing system which meets your needs for the miniaturization of the next-generation devices and various testing environment.



Feature 1 : OTS - the newest positioning technology (Optical Target Scope)

OTS enables to measure the relative position of the cameras with absolute accuracy, which improved dramatically.
Based on the ACCRETECH metrology technology, OTS enables the self-correlation of the alignment optical system.
.OTS enables to measure the relative position of the cameras with absolute accuracy, which improved dramatically.
Based on the ACCRETECH metrology technology, OTS enables the self-correlation of the alignment optical system.


  
Feature 2 : QPU - super high-rigid chucking (Quad-Pod Unit)

To effectively attain the accuracy in positioning, the high rigidity of every part is greatly important.
The UF3000 uses the new technology of 4 axes driving mechanism (QPU) for Z-axis, enabling the high-rigid, stable probe contact.



Feature 3 : Load-port

Testing environment satisfying the users' needs is available by the common platform of 8-inch and 12-inch cassettes and the front allocation of the inspection tray. The machine is also ready for AMHS (Automated Material Handling System).

   


Feature 4 : TTG (Touch To Go)

Pursuing the easy operation, the UF3000 adopts the function to move to the position you touch on the map or image shown on the touch panel. Setting up is easy, and screen configuration is possible by the user definition.