酒农饭抛农内府酒(Accretech Korea)

 

 


 
Home > Product > Wafer Dicing Machines > A-CS-100A     



Automatic Cleaning System:A-CS-100A

Stand-alone wafer cleaning unit, A-CS-100A will provide best solution for cleaning and drying the wafer such as sawn with semi-automatic dicing saws.
High-pressure water spray up to 10 MPa driven by horizontal swinging arm will achieve excellent cleaning quality.


Feature :

  • Maximum rotation speed of spinning table is up to 3,000 min-1
  • Available frame size: 5 to 8”
  • Cleaning method: High-pressure,Rinse, Air dry (Driven by swing arm)
Specifications :

  • A-CS-100A Specifications

    Frame size capability 5 to 8”
    Spinning table speed 30 to 3000min-1
    High-pressure cleaning 30 to 10 MPa
    Rinse water pressure Less than 0.4 MPa
    Drying air pressure Less than 0.7 MPa
    Facilities  
    Power supply AC 100V 50-60Hz (Single phase)
    Power consumption 500 VA (Max.)
    Air supply 0.5 to 0.7 MPa 200 NL / min
    Water supply 0.2 to 0.7 MPa 2L / min
    Over-all dimension 400Wx650Dx1076F
    Over-all weight 125 kg


  • Catalog Download :

    ⒑ Automatic Cleaning System:A-CS-100A Catalog(PDF:211KB)