酒农饭抛农内府酒(Accretech Korea)

 

 


 
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Wafer Dicing Machines:PS280

Now, with two independent stages, cutting and positioning can proceed in parallel. The result - a maximum dicing speed up to twice that previously possible!
New connected handlers, shorten coordination time - bringing increased operation efficiency and substantial savings in processing time.


Feature :


  • Twin Cutting-stage Mechanisms and Independent Microscope Drive Mechanism

    The new parallel spindle drive shaft with an independent microscope drive shaft ? make simultaneous cutting and alignment operations possible. This combines with PS280’s twin cutting stage mechanisms to bring unparalleled performance!








  • Large Cutting Area

    PS280’s large cutting area ensures smooth scrap processing and easy maintenance (Patent pending).



  • Wide, Bright Image Processing

    The optical system comes with a wider visual field and higher, brighter resolution ? greatly assisting image processing during operations such as alignment. The results ? reduced alignment error and shorter alignment time (Patent pending).






  • Specifications :

  • A-WD-250S Specifications

    Items PS280
    Applicable work size (Max) 280 x 110 mm 215mm
    Saw-jig size (Max) ヵ312 mm
    Spindle type Mechanical bearing type
    Spindle output power 1.8 kW
    Rotation speed (Max) 30 min-1
    Blade size 3 inches
    X-axis cutting speed 0.1ⅵ600 mm/sec (X1, X2, both axes)
    Y1, Y2, and Microscope-axis stroke 300mm (Y1, Y2, both axes)
    Y1, Y2, and Microscope-axis positioning accuracy 0.005/300 mm
    Z1, Z2, and Focus-axis positioning accuracy 0.003/1 mm
    Theta-axis rotation range 195∑
    Power supply AC200~220V 3phase 50/60Hz
    Air supply 0.55~0.7 MPa 390 L/min
    D.I.water supply 0.4~0.5 MPa 12 L/min
    Spindle cooling water 0.2~0.5 MPa 3 L/min
    Machine size (W x D x H mm) 1600 x 1685 x 1760 mm


  • Catalog Download :

    ⒑ Wafer Dicing Machines:PS280 Catalog(PDF:966KB)