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酒农饭抛农内府酒(Accretech Korea)
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Home > Product > Wafer Dicing Machines > PS280
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Wafer Dicing Machines:PS280
Now, with two independent stages, cutting and positioning can proceed in parallel. The result - a maximum dicing speed up to twice that previously possible!
New connected handlers, shorten coordination time - bringing increased operation efficiency and substantial savings in processing time.
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Feature :
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Twin Cutting-stage Mechanisms and Independent Microscope Drive Mechanism
The new parallel spindle drive shaft with an independent microscope drive shaft ? make simultaneous cutting and alignment operations possible. This combines with PS280’s twin cutting stage mechanisms to bring unparalleled performance!
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Large Cutting Area
PS280’s large cutting area ensures smooth scrap processing and easy maintenance (Patent pending).
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Wide, Bright Image Processing
The optical system comes with a wider visual field and higher, brighter resolution ? greatly assisting image processing during operations such as alignment. The results ? reduced alignment error and shorter alignment time (Patent pending).
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Specifications :
A-WD-250S Specifications
| Items |
PS280 |
| Applicable work size (Max) |
280 x 110 mm 215mm |
| Saw-jig size (Max) |
ヵ312 mm |
| Spindle type |
Mechanical bearing type |
| Spindle output power |
1.8 kW |
| Rotation speed (Max) |
30 min-1 |
| Blade size |
3 inches |
| X-axis cutting speed |
0.1ⅵ600 mm/sec (X1, X2, both axes) |
| Y1, Y2, and Microscope-axis stroke |
300mm (Y1, Y2, both axes) |
| Y1, Y2, and Microscope-axis positioning accuracy |
0.005/300 mm |
| Z1, Z2, and Focus-axis positioning accuracy |
0.003/1 mm |
| Theta-axis rotation range |
195∑ |
| Power supply |
AC200~220V 3phase 50/60Hz |
| Air supply |
0.55~0.7 MPa 390 L/min |
| D.I.water supply |
0.4~0.5 MPa 12 L/min |
| Spindle cooling water |
0.2~0.5 MPa 3 L/min |
| Machine size (W x D x H mm) |
1600 x 1685 x 1760 mm |
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Catalog Download :
⒑ Wafer Dicing Machines:PS280 Catalog(PDF:966KB)
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