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Wafer Dicing Machines:A-WD-10B

This multipurpose dicing machine realizes ease of use with the adaptation of the much sought-after space saving factor, slide cover system and function management system


Feature :

  • The Z-axis drive unit encoder system stepping motor guarantees high accuracy and reliability, and the X- and Y- axis slide section has a high accuracy, high rigidity linear guide.
  • Simultaneous 2-axis control of X- and Y-axis and high throughput, with a max. speed of X-axis: 450mm/s, Y-axis: 80mm/s and Z- axis: 40 mm/s.
  • A conveniently-located compact operating panel, rubber switch and jog dial optimized to the operation type (one hand operation) are used; an LCD panel is also used.
  • Common usages

    し Electronic parts (SMD, HIC, Piezo device, etc)
    し Semiconductors (Si, GaAs, etc)
    し Glass (crystal, filter, small LCD, etc)
    し Thermal Head (Small), New Materials


    The clarity of the microscope image and the accuracy of image recognition are improved by LED lighting.
    (Ring lighting specification: Optional)



    User-friendly Operating Panel

    Operation Display

    Function Management System
    Registering frequently used functions and creating shortcuts improves operability.


  • Specifications :

  • A-WD-10B Specifications

    Work Size 162 × 162 mm
    X axis Movement stroke 290 mm
    Cutting speed 0.1 - 450 mm/s
    Y axis Movement stroke 162 mm
    Maximum speed 80 mm/s
    Positioning accuracy 5 µm
    Z axis Movement stroke 35 mm
    speed 40 mm/s
    Resolution 0.0001 mm
    θ axis Rotation range 290°
    Positioning resolution 0.00018°(0.648")
    Alignment Microscope type Split-field type
    Camera, LCD Standard (12.1" magnification 211 ×)
    Spindle Type Air spindle with a built-in high-frequency AC motor
    Maximum revs. 40,000 min-1
    Maximum output 900W
    Others Power supply 200/220V AC , 3 phase
    Power consumption 2kVA
    Air supply Air supply 0.55 - 0.6 MPa, 180ℓ/min
    Spindle coolant water 0.2 - 0.5 MPa, 1.5ℓ/min
    Cutting water 0.2 - 0.5 MPa, 5ℓ/min max
    Equipment dimensions, weight 650 W × 890 D × 1,300 H mm, 500 kg


  • Main Options

    し Non-contact optical cutter setting unit
    し Blade breakage detector
    し 3” flange compatibility
    し Y-scale positioning accuracy:2 レm/162 mm
    し Cover interlock
    し Ring lighting
    し Middle power spindle
    し 3 color indication lamp
    し Mist fan
    し CE marking
    し A-CS-100A (Spin Cleaner/Dryer)





  • Catalog Download :

    ⒑ Wafer Dicing Machines:A-WD-10B Catalog(PDF:339KB)