酒农饭抛农内府酒(Accretech Korea)

 

 


 
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Wafer Dicing Machines:AD20T

Revolutionary axis design orientation creates the smallest twin spindle Dicing Saw


Feature :


  • Foot print

    The world’s smallest footprint. Footprint reduced 40% compared with Accretech’s existing machines.


  • High Throughput

    Twin-spindle design. Substantially higher through-put resulting in lower CoO.


  • High Accuracy

    Cutting quality is improved with the new design due to high rigidity and low vibration.


  • Space Saving

    Besides achieving high throughput,high processing quality and easy operation, this model has the smallest footprint of any machine for CSP substrates in the world.


  • Catalog Download :

    ⒑ Wafer Dicing Machines: AD20T Catalog(PDF:369KB)