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Wafer Dicing Machines:A-WD-250S

Fully automated dicing machine for 8 inch wafer and large-sized substrates


Feature :


  • Largi-sized substrates



    With a Y-axis stroke of 256 mm, large-sized substrates (long side:230 mm) can be processed. Additionally, frames mounted with two substrates can also be automatically processed.


  • High Reliability


    Blade breakage detector

    A highly sensitive optical method detects blade breakage in real time.


  • High Proccessing Quality



    A high-resolution LCD screen and touch panel produce an operation screen that is easy to understand and use.


    Inspection stage for monitoring cutting quality

    The designated wafer is automatically extracted to the inspection stage for inspection which is indispensable for dicing process. After inspection,the wafer is automatically returned to the original slot from the inspection stage.


    Keeps the wafer clean

    The suction-type frame handling is clean, reliable, and speedy processing with the least waiting time. As wafers are picked up by a different suction mechanism before and after cleaning, wafers are kept clean after the cleaning process.


  • Space Saving

    Besides achieving high throughput,high processing quality and easy operation, this model has the smallest footprint of any machine for CSP substrates in the world.


  • Specifications :

  • A-WD-250S Specifications

    Cutting wafer size 1" - 8", 230 × 145 mm (CSP substrates)
    Usable frame sizes 5", 6", 8"
    X axis Movement stroke 400 mm
    Cutting speed 0.1 - 600 mm/s
    Y axis Movement stroke 256 mm
    Maximum speed 80 mm/s
    Z axis Movement stroke 35 mm
    Resolution 0.0002 mm
    θ axis Rotation range 290°
    Minimum angular setting range 0.648"
    Alignment Microscope High/ Low magnification are interchangeable
    Magnifications on the monitor High : 350 × Low : 88 ×
    Spindle Type DC brushless motor internal air spindle
    Maximum revs. 60,000 min-1
    Spinner Maximum revs. 3,000 min-1
    Others Power supply 200/220/240/380/ 415 V AC ±10%, 3 phase
    Power consumption 2.5 kVA
    Air supply 0.5 - 0.6 MPa, 220ℓ/min
    Spindle coolant water 0.2 - 0.5 MPa, 1.5ℓ/min
    Cutting water 0.4 - 0.5 MPa, 2 - 8ℓ/min
    Nitrogen gas supply 0.5 - 0.6 MPa, 100ℓ/min
    Equipment dimensions / weight 1153 W × 1,170 D × 1,300 H mm / 1,000 kg


  • Options

    Optical cutter set unit

    The cutting position is set without any physical contact, avoiding damage to the blade.



    Shape recognition device

    This device automatically recognizes the shape of broken and partial wafers and optimizes the processing range to enable highly efficient processing.

    Cassette for automatic dressing

    A frame mounted with up to five dress boards or mirror wafers can be mounted to allow automatic dressing, even while the machine is in motion.



    Built-in UV curing unit

    Low cost, high performance UV curing unit can be loaded.



    Bar code recognition for automatic device data changeover

    Bar codes marked on cassettes or frames can be read to change device data automatically.

    Melody alarm

    The alarm can be set to play a specified melody.

    System compatible with FA

    GEM networks systems is available.

    High-pressure pump unit

    This unit produces high pressured water for spinner cleaning.

    Booster pump unit

    This unit boosts the pressure of water for cutting.

    Thermo regulator for water

    This equipment controls temperature of feed water (D. I. Water).



  • Catalog Download :

    ⒑ Wafer Dicing Machines:A-WD-250S Catalog(PDF:1.2MB)