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Wafer Dicing Machines:A-WD-200T

High throughput achieved by a new concept The A-WD-200T uses an opposing, twin spindle arrangement. This unique concept minimizes motion and delivers a massive boost in throughput.


Feature :

  • High Throughput

       An opposing, twin spindle arrangement and accelerated motion on the X-axis (up to 600mm/sec) achieve greater throughput.


    The mechanism uses linear motor, ceramic guides and air bearings.




  • High Reliability

    By using a linear motor on the X-axis, in addition to air bearings and ceramic guides, we have produced a completely contact-free drive mechanism, which is maintenance free. The suction-type frame handling system uses our unique and renowned methods to process wafers cleanly and rapidly, with remarkable reliability. Moreover, the new high-speed high-rigidity spindles achieve excellent reliability and low vibration.


    Our unique frame handling system

    Keeps the wafer clean

    The suction-type frame handling is clean, reliable, and speedy processing with the least waiting time. As wafers are picked up by a different suction mechanism before and after cleaning, wafers are kept clean after the cleaning process.

    Blade breakage detector

    A highly sensitive optical method detects blade breakage in real time.


  • Space Saving


    Besides achieving high throughput, high processing quality and easy operation, this twin-spindle machine which handles 8" wafers has the smallest footprint.


  • High Proccessing Quality

    The use of a linear motor for the X-axis reduces vibration, and the support mechanism for spindle has high rigidity. These advances enable higher cutting quality.


    Inspection stage for monitoring cutting quality

    The designated wafer is automatically extracted to the inspection stage for inspection which is indispensable for dicing process. After inspection, the wafer is automatically returned to the original slot from the inspection stage.


  • Easy Operation


    A high-resolution LCD screen and touch panel produce an operation screen that is easy to understand and use.


  • Specifications :

  • A-WD-200T Specifications

    Cutting wafer size 1"- 8"
    Usable frame sizes 6", 8"
    X-axis Stroke 450 mm
    Cutting stroke 250 mm
    Cutting speed 0.1 mm - 600 mm / sec
    Y-axis Stroke 250 mm
    Maximum speed 100 mm / sec
    Positioning accuracy 0.002 mm / 250 mm
    Z1 / Z2 axis Stroke 34 mm
    Maximum speed 40 mm / sec
    Positioning accuracy 0.003 mm / 1.0mm
    θ axis Rotation range 380∑
    Resolution 3.1958×10-2 rad
    Spindle Type Air spindles with built in DC brushless motors
    Maximum rotation speed 60,000rpm
    Rated output 1.2kW
    Spinner Maximum rotation speed 3,000rpm
    Misc. specifications Power supply Three phase AC 200 / 220 / 240 / 380 / 415 V ±10%
    Maximum power consumption 4.0kVA
    Air supply 0.5 - 0.7 Mpa 300L / min (ANR)
    Nitrogen gas supply 0.5 - 0.7 Mpa 100L / min (ANR)
    Coolant water 0.4 - 0.5 Mpa 12L / min max
    Low-pressure cleaning water 0.2 - 0.5 Mpa 5L / min max
    Device dimensions 1,230 (W) × 1,240 (D) - 732 (W) × 306 (D), 1,350 (H) mm


  • Options

    Blade breakage detection

    The state of the blade is constantly monitored during processing, protecting the wafer from damage by a broken blade.

    Optical cutter set unit

    The cutting position is set without any physical contact, avoiding damage to the blade.



    Shape recognition device

    This device automatically recognizes the shape of broken and partial wafers and optimizes the processing range to enable highly efficient processing.

    Cassette for automatic dressing

    A frame mounted with up to five dress boards or mirror wafers can be mounted to allow automatic dressing, even while the machine is in motion.



    Built-in UV curing unit

    Low cost, high performance UV curing unit can be loaded.



    Bar code recognition for automatic device data changeover

    Bar codes marked on cassettes or frames can be read to change device data automatically.

    Melody alarm

    The alarm can be set to play a specified melody.

    System compatible with FA

    GEM networks systems is available.

    High-pressure pump unit

    This unit produces high pressured water for spinner cleaning.

    Booster pump unit

    This unit boosts the pressure of water for cutting.

    Thermo regulator for water

    This equipment controls temperature of feed water (D. I. Water).



  • Catalog Download :

    ⒑ Wafer Dicing Machines:A-WD-200T Catalog(PDF:1MB)