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Wafer Dicing Machines:AD3000T/S

Tokyo Seimitsu Wafer Dicing Machine realizes the remarkable “CoO (Cost of Ownership)” by the world smallest footprint, high throughput, and high processing quality reinforced by the collaboration of the up-to-date technology.


Feature :

  • Optimized spacing by utilizing all components and optional unit well within the compartment

  • Standard Spindles up to 60,000rpm
       (80,000rpm as optional)

  • Enhanced throughput
       ㄧX axis 1,000mm/sec, Y axis 300mm/sec, and Z axis 80mm/sec
       ㄨTwo Optical Cutter-Set units
       ㄩThe Worlds’ smallest blade-to-blade distance

  • 17” LCD touch panel and new GUI

    GUI(Graphical User Interface) with simple layout and large touch-buttons allow users’ interactive operation

  • Easy and simple Kerf check function
       (AI kerf check function)

  • Over 10,000 recipes storable

  • USB port as standard
       (USB memory device can be used as external memory)

  • Ease-of-maintenance
       Wide maintenance door and front-side accessibility allows easy of routine maintenance

  • Optimized vacuum controller
       Reduces 50% of air consumption compared with existing model

  • Over 10,000 recipes storable

  • Over 10,000 recipes storable


  • Set up space :

    Tokyo Seimitsu has succeeded with footprint reduction by comparison with existing model



    Specifications :

  • AD3000T/S Specifications

    Max. work size ヵ 305mm
    Max. number of frames 12inch(430フ)
    Spindle Rotation 60,000 min-1
    OP:80,000 min-1
    Max. blade diameter フ60mm (2-Inch)
    Rated Output 1.8KW
    X axis Available cutting range 310mm
    Max. Speed 1000mm/s
    Y1/Y2 axes Available cutting range 310mm
    Max. Speed 300mm/s
    Resolution 0.078レm
    Accuracy 0.002mm/310mm
    Z1/Z2 axes Stroke 34mm
    Resolution 0.002レm
    Max. Speed 80mm/sec
    Repeatability 0.001mm
    ヨ axis Range of rotation 380∑
    Misc Voltage 3 Phase AC200ⅵ220V 【10%
    (Transformer adoptable)
    Power consumption 6.0kVA(MAX)
    Air pressure 0.55ⅵ0.7MPa
    Avg. Air consumption 210L/min (0.55MPa)
    Cutting Water, and others (pressure) 0.3ⅵ0.5MPa
    Cutting Water, and others (Max Flow) Cutting Water:10.0L/min
    Water curtain:3.0L/min
    Others:0.6L/min
    Cooling Water (pressure) 0.3ⅵ0.5MPa
    Cooling Water (Max Flow) 3.4L/min (0.3MPa)
    Exhaust 5.0З/min more
    Size (W*D*H) 1290mmX1530mmX1900mm
    Weight 1300kg


  • Catalog Download :

    ⒑ Wafer Dicing Machines:AD3000T/S Catalog(PDF:11MB)