酒农饭抛农内府酒(Accretech Korea)

 

 


 
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Polish Grinder: PG3000RM/PG200RM

ACCRETECH also offers the "RM option", having the additional process of the tape removing for thinner wafer after the tape mounting, in addition to the standard process of PG300/200.



PG3000 RM :
For 300mm Wafers



PG200 RM :
For 200mm Wafers
Feature 1 : Optional RM module
The RM200/300 offers a single-unit solution supplementing PG200/300 processing with additional functionality to remove protective tape from thinner wafers and apply wafers to dicing frames.

Feature 2 :
Performs the processes of the rough grinding, fine grinding, polishing and cleaning wafers on the both sides in a single machine.

Feature 3 :
All the processes are completed without moving the wafer on the same chuck table.

Feature 4 :
The smallest footprint in the world.

Feature 5 :
Environmental - friendly - subsurface damage reduction without chemicals.

Feature 6 :
System configuration