酒农饭抛农内府酒(Accretech Korea)

 

 


 
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Polish grinders simultaneously thin wafers while performing damage removal caused by the grinding process, and offer various applications for peripheral processes in the one system.

Polish Grinder: PG3000/PG200

The product of a unique ACCRETECH innovation, this Polish Grinder combines the wafer thinness required for IC cards and three-dimensional mounting technology with damage removal functions in a single device.




PG3000



PG200
Feature 1 :
Performs the processes of the rough grinding, fine grinding, polishing and cleaning wafers on the both sides in a single machine.

Performs the processes of the rough grinding, fine grinding, polishing and cleaning wafers on the both sides in a single machine.

Feature 2 :
All the processes are completed without moving the wafer on the same chuck table.

Feature 3 :
The smallest footprint in the world

Feature 4 :
Environmental - friendly - subsurface damage reduction without chemicals.

Feature 5 :
System configuration