酒农饭抛农内府酒(Accretech Korea)

 

 


 
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CMPs remove unevenness on wafer surfaces that occur during the production process. Applications are growing due to the increase of layers in semiconductor devices and the growing variety of wiring materials.

ChaMP: For 300mm Wafers

Combining the technological expertise built up by Accretech in precision measuring equipment and semiconductor manufacturing equipment, we now offer "the ChaMP Series", the CMP systems compatible with 300 mm wafers, with process performance required by design rules for 90 nm and 32 nm devices, and able to keep up with the most advanced volume-production fabs.



Feature 1 : Air-float Head "Sylphide"
Reference polishing is made possible via an air cushion that provides uniform pressure distribution.
Wafer pressure is applied by an airbag independent of ring pressure,
providing excellent low-pressure controllability and stability.
Zone control is available.


Feature 2 : Edge Exclusion of 1 mm



Feature 3 : Wafer Pressure Controllability & Repeatability



Feature 4 : Simple Maintenance for Polishing Heads - Ring Change

Demounting (approximately 5 seconds)


Slide the snap ring cover up with both hands

Spread the snap ring with your thumb (the retaining ring drops off)

Completely remove the retaining ring

Mounting (approximately 10 seconds)

  1. 1.Grip the snap ring with both hands and push the retainer into the carrier. Rotate it slightly to align the faces where the positioning frame slips into place.
  2. 2.Attach the snap ring round the whole circumference and slide the cover down.